Read Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages by Brian Young Online Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre model
| Title | : | Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages |
| Author | : | Brian Young |
| Rating | : | 4.68 (834 Votes) |
| Id Book | : | 0130289043 |
| Format Type | : | Paperback |
| Number of Pages | : | 560 Pages |
| Publish Date | : | 2000-10-19 |
| Type File | : | PDF, DOC, RTF, ePub |
*State-of-the-art techniques for predicting and achieving target performance levels *Theory, practice, general signal integrity issues, and leading-edge experimental techniques Model and simulate high-speed digital systems for maximum performance Maximizing the performance of digital systems means optimizing their high-speed interconnections. Digital Signal Integrity gives engineers all the theory and practical methods they need to accurately model and simulate those interconnections and predict real-world performance. Whether youre modeling microprocessors, memories, DSPs, or ASICs, these techniques will get you to market faster with greater reliability. Coverage includes: *In-depth reviews of inductance, capacitance, resistance, single and multiconductor transmission lines, generalized termination schemes, crosstalk, differential signaling, and other modeling/simulation issues *Multiconductor interconnects: packages, sockets, connectors and buses *Modal decomposition: understanding t
BRIAN YOUNG is a Member of the Technical Staff at the Somerset Design Center, Semiconductor Product Sector, Motorola, working on packaging, interconnects, and I/O design for PowerPC microprocessors and the RapidIO Interconnect Architecture. For over seven years he has specialized in simulation, modeling, measurement, and performance studies for high-speed signaling with microprocessors, fast static RAMs, and DSPs. He has served as an Assistant Professor in the Department of Electrical Engineering at Texas A&M University, College Station, and as an adjunct professor in the Department of Electrical Engineering at the University of Texas, Austin. Dr. Young holds a Ph.D from the University of Texas, Austin and holds six patents related to packaging. He has published numerous articles in conferences and journals.
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